Feature
- Harwin EZ Boardware SMT RFI/Grounding Spring Contacts. EZ-BoardWare SMT grounding/RFI spring contacts for use on surface mount PCBs that are in contact with metal shields or frames. The simple C style design of these EZ-BoardWare spring contacts provides excellent spring properties and ensures positive contact with the mating surface. These EZ-BoardWare RFI/grounding contacts are suitable for both wiping and sliding actions and are ideal for automated requirements using standard placement equipment. Stock numbers < 788-4852') 788-4852/ and < 788-4858') 788-4858/ are multi-directional spring contacts that have a unique spring feature that works in both the vertical and horizontal orientations. This feature makes them ideal for use in PCB edge connections to a chassis. Features and Benefits. Ideal for use on surface mount PCBs Excellent spring properties Designed for automated application using standard placement equipment Suitable for wiping and sliding applications Multidirection versions for PCB edge connections Available in a wide range working heights. Applications. The compact size of these EZ-BoardWare grounding spring contacts makes them ideal for use in areas where there is limited access and in Blindmate applications. Typical applications include POS tracking, home entertainment and instrument panels, Industrial process control equipment, Mobile power units, Motion control units
Specifications
- Quantity:1set(1500pieces)
- Material:Titanium Copper Alloy
- Fixing Method:Surface Mount
- Contact Plating:Gold
- Dimensions:7 x 2.5 x 5.5mm
- Height:5.5mm
- Length:7mm
- Width:2.5mm
- CODE No.:173-0898
-- Products images and contents from HARWIN website --
